No tooling required! "Wafer plating device"
A plating device that does not use jigs. It not only eliminates the complexity of installation and plating defects due to the deterioration of jig components, but also significantly improves the yield rate of good products!
The current wafer plating equipment is predominantly vertical, and the usability of the jigs attached to the plating devices is poor, leading to many issues such as the following: - Parts must be constantly replaced due to erosion from the plating solution. - Poor electrical conductivity results in defective plating. - The structure takes a long time to set the wafers, hindering smooth operations. - Difficult to transport, making efficient movement challenging. Furthermore, there is a demand for improved production efficiency due to the increasing need for high aspect ratio compatibility (supply of metal ions, uniform liquid flow) and enhanced uniform film thickness. Our "Wafer Plating Equipment" is jig-free, horizontal, and upward-facing, allowing us to resolve the issues present in conventional products. *For more details, please download the PDF or feel free to contact us.*
- Company：GDLAB合同会社
- Price：Other
